Method to attach sensors to substrates for operation under harsh temperature conditions


This invention provides a method to for mounting devices, for example surface acoustic wave (SAW) devices, upon substrates under harsh temperature conditions. The devices are conventionally attached directly to the substrate, such as to surfaces of jet engines, helicopter rotor blades, or static parts of an engine. However, direct attachment often leads to performance degradation, or even outright failure of the attached device when operating under high and/or variable temperatures.


Patent Pending in Europe and US

US Patent

Patent Information:
Sensors & Electronics
For Information, Contact:
Kris Burton
Technology Commercialization Manager
University of Maine
Scott Moulzolf
Mauricio Pereira Da Cunha
Thomas Moonlight
Alberto Canabal
George Harris
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