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Method to attach sensors to substrates for operation under harsh temperature conditions

This invention provides a method to for mounting devices, for example surface acoustic wave (SAW) devices, upon substrates under harsh temperature conditions. The devices are conventionally attached directly to the substrate, such as to surfaces of jet engines, helicopter rotor blades, or static parts of an engine. However, direct attachment often leads...

Published: 7/23/2015 | Inventor(s): Scott Moulzolf, Mauricio Pereira Da Cunha, Thomas Moonlight, Alberto Canabal, George Harris

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Category(s): Sensors & Electronics